Are you looking for the best HDI printed circuit board suppliers? Understanding the top factories can significantly impact your project’s success. By knowing the leading options, you can ensure quality, reliability, and innovation. Dive in to discover the top contenders and make informed choices for your next project!
High Density Interconnect (HDI) PCB – mcl
Product Details: High-density interconnect (HDI) printed circuit boards (PCBs) with higher circuitry density and advanced features like buried and blind vias, and microvias.
Technical Parameters:
– Higher circuitry density per unit than conventional PCBs
– Features include through vias, buried vias, coreless construction, and passive s…
Application Scenarios:
– Consumer electronics such as smartphones, tablets, and wearables
– Automotive and aerospace industries for engine controls and diagnostics
Pros:
– Smaller size and lower weight, allowing for more functionality in a compact spac…
– Improved electrical performance with lower power consumption and better signal i…
Cons:
– Higher manufacturing complexity and potential for increased costs
– Requires specialized equipment and skilled technicians for production
HDI Printed Circuit Boards | HDI Layout | Sierra Circuits
Product Details: HDI printed circuit boards with advanced specifications including trace spaces down to 1.5 mil and holes as small as 2 mil, featuring blind vias, buried vias, and microvias.
Technical Parameters:
– Down to 1.5-mil trace space, 2-mil holes
– Up to 4 lamination cycles
Application Scenarios:
– Medical miniaturization for devices operating directly with the human body
– Aerospace and DoD electronics for mission critical functions
Pros:
– Enhanced signal integrity and reduced signal distortion
– Higher yield rates due to improved control of drill-to-copper
Cons:
– Potentially higher initial costs compared to standard PCBs
– Complex design requirements may necessitate expert consultation
HDI PCB Manufacturing – High Density Circuit Fabrication – FlexPCB.com
Product Details: High Density Interconnects (HDI PCBs) manufactured by Flex PCB for various industries.
Technical Parameters:
– Microvia size down to 25 microns
– Line and width spacing down to 19 microns
– Copper thickness down to 5 microns
– Blind microvia plating aspect ratio (depth to diameter): 1.2:1
– Core dielectric thickness down to 12 microns
Application Scenarios:
– Military
– Aerospace
– Supercomputing
– Medical devices
– Next-generation silicon testing
– Chip packaging
Pros:
– Significantly increases ROI by saving space and weight
– Quick turnaround times for mission-critical circuits
Cons:
– Potentially higher manufacturing costs compared to traditional PCBs
– Complexity in design and manufacturing process
HDI PCB | PCB Electronics & Assembly | PCB Factory | Printed Circuit …
Product Details: HDI PCB (High-Density Interconnect Printed Circuit Board)
Technical Parameters:
– Layer count: 4-20 layers
– Minimum trace width: 3 mils
Application Scenarios:
– Smartphones
– Medical devices
Pros:
– Higher circuit density
– Improved performance
Cons:
– Higher manufacturing cost
– Complex design requirements
HDI PCBs | HDI Technology Solutions | RedSTAR Worldwide LLC
Product Details: HDI Printed Circuit Boards (PCBs) from Redstar Worldwide, designed for high density interconnect technology.
Technical Parameters:
– Compact size with high interconnectivity
– Cost-efficient compared to standard PCBs
Application Scenarios:
– Medical Devices
– Wireless Communications Devices
Pros:
– Improved functionality and data storage
– Less prone to errors and more durable
Cons:
– Potentially higher initial design complexity
– Requires specialized manufacturing processes
HDI PRINTED CIRCUIT BOARDS – PCB Unlimited
Product Details: HDI PCBs are high-density interconnect printed circuit boards that utilize microvias for improved performance and space efficiency.
Technical Parameters:
– Microvias with a diameter less than 150 microns
– Various via types: Through-Hole, Blind, Buried, Microvias
Application Scenarios:
– Consumer devices such as smartphones and tablets
– Healthcare applications including monitoring and imaging devices
Pros:
– Improved signal integrity and reduced power consumption
– Cost-effective due to fewer required layers and components
Cons:
– Potentially higher initial manufacturing costs
– Complex design requirements may increase development time
HDI PCB Manufacturing
Product Details: High-Density Interconnect (HDI) PCBs manufactured by UnityPCB, suitable for intricate electronic applications.
Technical Parameters:
– Up to 18 layers
– Board thickness: 0.8-5.0 mm
Application Scenarios:
– Miniaturized electronics
– High-performance circuit applications
Pros:
– Enables high-density component packaging
– Enhances electrical performance with improved signal integrity
Cons:
– Challenges in manufacturing micro devices
– Requires sophisticated manufacturing processes
HDI Printed Circuit Boards – High Density Interconnect PCB Technology
Product Details: HDI Printed Circuit Boards (High Density Interconnect PCB Technology) are designed to support more technology on fewer layers, featuring blind and buried vias, and microvias of .006 or less in diameter.
Technical Parameters:
– Higher circuitry density than traditional circuit boards
– Supports multiple via processes including via in pad and blind via technology
Application Scenarios:
– Consumer electronics such as cameras, laptops, and cell phones
– Mobile computing and remote work applications
Pros:
– Allows for smaller components and increased I/O in smaller geometries
– Reduces layer count and material costs while maintaining quality
Cons:
– Increased manufacturing complexity and time
– Higher initial costs due to microvia processes
HDI PCB Manufacturer, High-density Interconnect PCB | Unitepcb
Product Details: High-density Interconnect PCB (HDI) with features like microvia, blind and buried vias, built-in lamination, and high signal performance.
Technical Parameters:
– Laser drilled 50 micron micro vias
– 19 micron line widths and space widths
Application Scenarios:
– Cell phones
– Medical devices
Pros:
– Higher component density per square inch
– Lighter and smaller than standard PCBs
Cons:
– Requires special equipment for manufacturing
– Longer development times due to complex processes
HDI Printed Circuit Boards | Advanced PCB – PCBgogo
Product Details: HDI PCB fabrication for advanced electronic devices including automotive electronics, industrial equipment, and communication devices.
Technical Parameters:
– Layer count: 1-14
– Max PCB size: 1200 × 300mm for 1-2 layers, 600 × 500mm for multi-layers
Application Scenarios:
– High-end electronic devices
– Complex industrial equipment
Pros:
– Advanced technology and production equipment
– Quick turn PCB fabrication and assembly
Cons:
– Potentially higher cost due to advanced manufacturing processes
– Requires specialized equipment for production
Related Video
Comparison Table
Company | Product Details | Pros | Cons | Website |
---|---|---|---|---|
High Density Interconnect (HDI) PCB – mcl | High-density interconnect (HDI) printed circuit boards (PCBs) with higher circuitry density and advanced features like buried and blind vias, and micr… | – Smaller size and lower weight, allowing for more functionality in a compact spac… – Improved electrical performance with lower power consumption a… | – Higher manufacturing complexity and potential for increased costs – Requires specialized equipment and skilled technicians for production | www.mclpcb.com |
HDI Printed Circuit Boards | HDI Layout | Sierra Circuits | HDI printed circuit boards with advanced specifications including trace spaces down to 1.5 mil and holes as small as 2 mil, featuring blind vias, buri… | – Enhanced signal integrity and reduced signal distortion – Higher yield rates due to improved control of drill-to-copper |
HDI PCB Manufacturing – High Density Circuit Fabrication – FlexPCB.com | High Density Interconnects (HDI PCBs) manufactured by Flex PCB for various industries. | – Significantly increases ROI by saving space and weight – Quick turnaround times for mission-critical circuits | – Potentially higher manufacturing costs compared to traditional PCBs – Complexity in design and manufacturing process | flexpcb.com |
HDI PCB | PCB Electronics & Assembly | PCB Factory | Printed Circuit … | HDI PCB (High-Density Interconnect Printed Circuit Board) |
HDI PCBs | HDI Technology Solutions | RedSTAR Worldwide LLC | HDI Printed Circuit Boards (PCBs) from Redstar Worldwide, designed for high density interconnect technology. | – Improved functionality and data storage – Less prone to errors and more durable |
HDI PRINTED CIRCUIT BOARDS – PCB Unlimited | HDI PCBs are high-density interconnect printed circuit boards that utilize microvias for improved performance and space efficiency. | – Improved signal integrity and reduced power consumption – Cost-effective due to fewer required layers and components | – Potentially higher initial manufacturing costs – Complex design requirements may increase development time | www.pcbunlimited.com |
HDI PCB Manufacturing | High-Density Interconnect (HDI) PCBs manufactured by UnityPCB, suitable for intricate electronic applications. | – Enables high-density component packaging – Enhances electrical performance with improved signal integrity | – Challenges in manufacturing micro devices – Requires sophisticated manufacturing processes | unitypcb.com |
HDI Printed Circuit Boards – High Density Interconnect PCB Technology | HDI Printed Circuit Boards (High Density Interconnect PCB Technology) are designed to support more technology on fewer layers, featuring blind and bur… | – Allows for smaller components and increased I/O in smaller geometries – Reduces layer count and material costs while maintaining quality | – Increased manufacturing complexity and time – Higher initial costs due to microvia processes | www.epectec.com |
HDI PCB Manufacturer, High-density Interconnect PCB | Unitepcb | High-density Interconnect PCB (HDI) with features like microvia, blind and buried vias, built-in lamination, and high signal performance. | – Higher component density per square inch – Lighter and smaller than standard PCBs | – Requires special equipment for manufacturing – Longer development times due to complex processes |
HDI Printed Circuit Boards | Advanced PCB – PCBgogo | HDI PCB fabrication for advanced electronic devices including automotive electronics, industrial equipment, and communication devices. | – Advanced technology and production equipment – Quick turn PCB fabrication and assembly | – Potentially higher cost due to advanced manufacturing processes – Requires specialized equipment for production |
Frequently Asked Questions (FAQs)
What is an HDI printed circuit board?
HDI stands for High-Density Interconnect, which refers to a type of printed circuit board that has a higher wiring density than traditional boards. This is achieved through smaller traces and pads, allowing for more components in a smaller area. HDI boards are commonly used in advanced electronic devices like smartphones and tablets.
What are the advantages of using HDI PCBs?
HDI PCBs offer several benefits, including reduced size and weight, improved performance due to shorter signal paths, and enhanced thermal management. They also allow for more complex designs, making them ideal for high-tech applications.
How do I choose the right HDI PCB supplier?
When selecting an HDI PCB supplier, consider their experience, manufacturing capabilities, quality certifications, and customer reviews. It’s also important to evaluate their ability to meet your specific design requirements and delivery timelines.
What is the typical lead time for HDI PCB production?
Lead times for HDI PCB production can vary based on complexity and order volume, but they generally range from 2 to 6 weeks. It’s best to discuss your project timeline with the supplier to ensure they can meet your needs.
Can HDI PCBs be used for prototyping?
Yes, HDI PCBs are suitable for prototyping. Many suppliers offer prototype services, allowing you to test your designs before full-scale production. This is a great way to identify any issues and make necessary adjustments early in the process.